WCBLF227L2031
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WCBLF227L2031
Product_Category
Solder
Manufacturer
Canfield Technologies
Type
BLF 227 WATER SOLUBLE FLUX 8 OZ
Encapsulation
Packages
Spool
RoHS
YES
Price
$35.1900
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Specifications
TYPEDESCRIPTION
MfrCanfield Technologies
Series-
PackageSpool
Product StatusACTIVE
Diameter0.031" (0.79mm)
Wire Gauge20 AWG, 22 SWG
CompositionBLF 227 (99.17Sn/.8Cu/.03Ni)
TypeWire Solder
Melting Point440°F (227°C)
FormSpool, 8 oz (227g), 1/2 lb
ProcessLead Free
Flux TypeWater Soluble
Storage/Refrigeration Temperature50°F ~ 104°F (10°C ~ 40°C)
Shelf Life StartDate of Manufacture
Shelf Life24 Months
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