TSX713
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TSX713
Product_Category
Soldering, Desoldering, Rework Tips, Nozzles
Manufacturer
EDSYN Inc.
Type
REFLOW VACUUM TIP, HOLE DIA: 1.3
Encapsulation
Packages
Bag
RoHS
YES
Price
$30.0000
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Specifications
TYPEDESCRIPTION
MfrEDSYN Inc.
SeriesSOLDAVAC®
PackageBag
Product StatusACTIVE
Diameter0.051" (1.30mm)
Length0.551" (14.00mm)
Tip ShapeNozzle
Tip TypeRework
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