RP605Z363B-E2-F
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RP605Z363B-E2-F
Product_Category
Power Management - Specialized
Manufacturer
RICOH/Nisshinbo Micro Devices
Type
300MA ULTRA-LOW POWER BUCK BOOST
Encapsulation
Packages
Tape & Reel (TR)
RoHS
YES
Price
$1.0600
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Specifications
PDF(1)
TYPEDESCRIPTION
MfrRICOH/Nisshinbo Micro Devices
SeriesRP605x
PackageTape & Reel (TR)
Product StatusACTIVE
Package / Case20-XFBGA, WLCSP
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply1.8V ~ 5.5V
ApplicationsBattery Management, Power Supplies
Current - Supply300nA
Supplier Device Package20-WLCSP-P3 (2.32x1.71)
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