OM13496UL
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OM13496UL
Product_Category
Prototyping Boards, Fabrication Kits
Manufacturer
NXP Semiconductors
Type
SURFACE MOUNT TO DIP EVALUATION
Encapsulation
Packages
Bulk
RoHS
YES
Price
$28.6900
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Specifications
PDF(1)
TYPEDESCRIPTION
MfrNXP Semiconductors
Series-
PackageBulk
Product StatusACTIVE
Number of Positions16, 28
Quantity23 Pieces (4 Values - Mixed Quantities)
Kit TypeAdapter, Breakout Boards
SpecificationsSMD to DIP
Package AcceptedQSOP, TSSOP28, XFBGA, XQFN
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