DF9-19S-1V(20)
  • image of Arrays, Edge Type, Mezzanine (Board to Board)> DF9-19S-1V(20)
DF9-19S-1V(20)
Product_Category
Arrays, Edge Type, Mezzanine (Board to Board)
Manufacturer
Hirose Electric Co., Ltd.
Type
CONN RCPT 19POS SMD TIN
Encapsulation
Packages
Tube
RoHS
NO
Price
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Specifications
PDF(1)
TYPEDESCRIPTION
MfrHirose Electric Co., Ltd.
SeriesDF9
PackageTube
Product StatusOBSOLETE
FeaturesBoard Guide, Solder Retention
Connector TypeReceptacle, Outer Shroud Contacts
Contact FinishTin
Mounting TypeSurface Mount
Number of Positions19
Pitch0.039" (1.00mm)
Height Above Board0.130" (3.30mm)
Mated Stacking Heights4.3mm
Number of Rows2
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