AGFD023R24C2I1V
  • image of System On Chip (SoC)> AGFD023R24C2I1V
AGFD023R24C2I1V
Product classification
System On Chip (SoC)
Manufacturer
Intel
Type
IC
Encapsulation
Package
Tray
RoHS
NO
Price
$29,893.0300
Available options
Quantity
Stock : 0
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Specifications
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA
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