AGFB023R24C2E2V
  • image of System On Chip (SoC)> AGFB023R24C2E2V
AGFB023R24C2E2V
Product_Category
System On Chip (SoC)
Manufacturer
Intel
Type
IC
Encapsulation
Packages
Tray
RoHS
NO
Price
$19,621.0600
{{title}}
{{description}}
captcha
{{btnStr}}
Specifications
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O480
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA
86-13826519287‬
1