28-6551-11
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28-6551-11
Product_Category
IC Sockets
Manufacturer
Aries Electronics, Inc.
Type
CONN IC DIP SOC
Encapsulation
Packages
Bulk
RoHS
YES
Price
$17.6600
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Specifications
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TYPEDESCRIPTION
MfrAries Electronics, Inc.
Series55
PackageBulk
Product StatusACTIVE
FeaturesClosed Frame
Mounting TypeThrough Hole
TypeDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)28 (2 x 14)
TerminationSolder
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Material - PostBeryllium Copper
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