28-3554-11
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28-3554-11
Product_Category
IC Sockets
Manufacturer
Aries Electronics, Inc.
Type
CONN IC DIP SOC
Encapsulation
Packages
Bulk
RoHS
YES
Price
$17.6600
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Specifications
PDF(1)
TYPEDESCRIPTION
MfrAries Electronics, Inc.
Series55
PackageBulk
Product StatusACTIVE
FeaturesClosed Frame
Mounting TypeThrough Hole
TypeDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature-55°C ~ 250°C
Number of Positions or Pins (Grid)28 (2 x 14)
TerminationSolder
Material Flammability RatingUL94 V-0
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Material - PostBeryllium Copper
Termination Post Length0.110" (2.78mm)
Current Rating (Amps)1 A
86-13826519287‬
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