| Mfr | Aries Electronics, Inc. |
| Series | 55 |
| Package | Bulk |
| Product Status | ACTIVE |
| Features | Closed Frame |
| Mounting Type | Through Hole |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Termination | Solder |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Nickel Boron |
| Contact Finish Thickness - Mating | 50.0µin (1.27µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Nickel Boron |
| Contact Finish Thickness - Post | 50.0µin (1.27µm) |
| Contact Material - Post | Beryllium Copper |
