| TYPE | DESCRIPTION |
| Mfr | Aries Electronics, Inc. |
| Series | PRS |
| Package | - |
| Product Status | ACTIVE |
| Features | Closed Frame |
| Mounting Type | Through Hole |
| Type | PGA, ZIF (ZIP) |
| Termination | Solder |
| Housing Material | Polyphenylene Sulfide (PPS) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Post | Beryllium Copper |
