Product_Category
Edgeboard Connectors
Manufacturer
Molex
Type
CONN EDGE DUAL FML 330POS 0.030
Encapsulation
Packages
Tray
RoHS
YES
Price
| TYPE | DESCRIPTION |
| Mfr | Molex |
| Series | HiSpec 71109 |
| Package | Tray |
| Product Status | OBSOLETE |
| Features | Board Guide |
| Gender | Female |
| Contact Finish | Gold |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | 330 |
| Pitch | 0.030" (0.76mm) |
| Operating Temperature | -40°C ~ 85°C |
| Read Out | Dual |
| Card Type | Non Specified - Dual Edge |
| Card Thickness | 0.062" (1.57mm) |
| Termination | Solder |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Material - Insulation | Liquid Crystal Polymer (LCP), Glass Filled |
| Contact Material | Phosphor Bronze |
| Number of Positions/Bay/Row | 56; 62; 47 |
| Number of Rows | 2 |
